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8. In any case, it allows to go beyond the rated 150 °C limit.
9. The description of the spindle driver circuit is given in Section 8.10.
10. RSENSE = 0.25 &!. Model for a motor phase: RLC network in parallel (LP = 1.5 mH, CP = 100 pF, RP = 4.6 k&!) in
series with a resistor RS = 3.2 &!. Guaranteed by design.
11. VVCMSENSEL = 0.4 V, VVCMSENSEH = 0 V, measured Vsout =VO, force Vsout =VO + 10 mV.
12. VVCMSENSEL = 0 V, VVCMSENSEH = 0.4 V, measured Vsout =VO, force Vsout =VO - 10 mV.
13. VPARKVOLT(max) =3 × VBE, VPARKVOLT =3 × 0.70 - 3 × 2e - 3 × (T - 25) without resistor.
14. Brake-after-park mode when in sleep, POR or over-temperature mode.
15. Rds(on)T(park) =Rds(on)(park) +TRds(on)(park) × (T - 25).
16. Rds(on)T(break) =Rds(on)(break) +TRds(on)(break) × (T - 25).
17. VBE = 0.65 + 2e - 3 × (T - 25).
1998 Nov 02 46
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
13 APPLICATION INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Power supplies monitor
CCPOR POR time capacitor (time tC) note 1 - 100 - nF
CCHK5 analog 5 V filter between CHK5 and ground - 1 - nF
CCHK12 analog 12 V filter between CHK12 and ground - 1 - nF
Spindle driver
CSPCCOUT spindle current control loop function of the motor - 10 - nF
capacitor characteristics
RSLEW slew up and down resistor note 2 - 200 - k&!
RSPSENSE spindle sense resistor - 0.25 - &!
VCM driver
RVCMCOMPRC resistor of compensation function of the VCM - 130 - k&!
RC network characteristics
CVCMCOMPRC capacitor of compensation function of the VCM - 1 - nF
RC network characteristics
RVCMSENSE VCM sense resistor - 0.33 - &!
RFEEDBACK feedback resistor function of the VCM - 2.67 - k&!
characteristics
RVCMSEEK seek mode resistor function of the VCM - 2.43 - k&!
characteristics
RVCMTRACKFW track-following mode resistor function of the VCM - 10 - k&!
characteristics
VI input voltage controlling the 1.5 - 3.5 V
current
Vref2V5 2.5 V reference voltage - 2.5 - V
Clamp line
CCLAMP clamp capacitor between - 1 - µF
CLAMP line and ground
Charge pump generator
CCAPX pump capacitor between - 10 - nF
pins BSTCP1 and BSTCP2
CCAPY storage capacitor between - 22 - nF
pin CAPY and ground
Park and brake functions
CBRAKEP BRAKEPOWER capacitor brake time = 10 s; - 1 - µF
speed = 5400 RPM;
Rcoil =5 &!; BEMF = 8.2 V
RBRAKEP resistor between BRAKEADJH brake time = 10 s; - 0 - M&!
and BRAKEPOWER speed = 5400 RPM;
Rcoil =5 &!; BEMF = 8.2 V
1998 Nov 02 47
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
CBRAKED BRAKEDELAY capacitor brake delay = 400 ms - 330 - nF
RBRAKED BRAKEDELAY resistor brake delay = 400 ms - 650 - k&!
RPARKVOLT PARKVOLT resistor VPARKVOLT = 1.25 V; - 250 - k&!
VCLAMP =8V
Notes
1. The description of the Power-On Reset (POR) circuit is given in Section  Power-on reset .
2. The description of the spindle driver circuit is given in Section  Spindle driver .
1998 Nov 02 48
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
CCAPX
microcontroller 12 V 5 V
handbook, full pagewidth
CCAPY
5 V
RH5 (1)
CCPOR 24 13 21 22 23 19 25 15 20 44 18 16 17
CPOR
45
CHK5
46
RSLEW
SLEW
CCHK5 RL5 (1)
12
(1)
CSPCCOUT
SPCCOUT
14
12 V
CBRAKEP
BRAKEPOWER
48
RH12 (1)
RBRAKEP (1)
CHK12
47
BRAKEADJH
49
CCHK12 RL12 (1)
RPARKVOLT
PARKVOLT
51
(1)
CT
CBRAKED
9
BRAKEDELAY
MOTA
50
72
RBRAKED
MOTB
74
REF2V5
40
spindle
MOTC
OM5193H motor
3
INTIN MOTSENSE3
38 73
INTINN
MOTSENSE2
read 37
76
PESAMP
channel
MOTSENSE1/
36
2
PESAMPN
SPSENSEH
35
RSPSENSE
GNDS/SPSENSEL
11
ADC[0]/INTOUT
28
ADC[1]/DIFOUT
NIVCM
29
69
ADC[2]/SOUT
VCMSENSEL
30
53
ADC[3]
31
RVCMSENSE
ADC[4]/TEMP
32
ADC[5] VCMSENSEH
33 52
VDDA2POWER
voice
1, 4 to 7,
M
coil
58 to 61,
motor
IVCM
64 to 67,
SWITCHGATE 62
70, 75,
8
10 55 56 57 77 39 27 54 78 to 80 26 71 68 63 34 41 42 43
RVCMCOMPRC
CVCMCOMPRC
two different
CCLAMP
RVCMSEEK
options
RVCMTRACKFW
RFEEDBACK
MGM993
(1) Optional components.
Fig.24 Application diagram.
1998 Nov 02 49
DDA2
DDD
DDA1
ZCROSS
CLOCK
SPCC
SDEN
SDATA
SCLOCK
POR
V
V
V
CAPY
BSTCP1
BSTCP2
AGND
GNDV
DGND
VCMIN
CLAMP1
CLAMP2
CLAMP3
DACOUT
HEATSINK
GNDVCM1
GNDVCM2
GNDVCM3
PWRBIAS1
PWRBIAS2
SCANTEST
SEEKSELECT
TRACKFWSELECT
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
14 PACKAGE OUTLINE
QFP80: plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT318-2
c
y
X
A
64 41
40
65
Z
E
e
A2
HE A
E
(A )
3
A1
w M
¸
pin 1 index
Lp
bp
L
80
25
detail X
1 24
w M ZD
v M A
bp
e
D B
HD v M B
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT A1 A2 A3 bp c D(1) E(1) e HD HE L Lp v w y ZD(1) ZE(1) ¸
max.
0.25 2.90 0.45 0.25 20.1 14.1 24.2 18.2 1.0 1.0 1.2
7o
mm
3.2 0.25 0.8 1.95 0.2 0.2 0.1
0.05 2.65 0.30 0.14 19.9 13.9 23.6 17.6 0.6 0.6 0.8
0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
95-02-04
SOT318-2
97-08-01
1998 Nov 02 50
Philips Semiconductors Product specification
Disk drive spindle and VCM with
OM5193H
servo controller
If wave soldering cannot be avoided, for QFP
15 SOLDERING
packages with a pitch (e) larger than 0.5 mm, the
15.1 Introduction
following conditions must be observed:
There is no soldering method that is ideal for all IC
" A double-wave (a turbulent wave with high upward
packages. Wave soldering is often preferred when
pressure followed by a smooth laminar wave)
through-hole and surface mounted components are mixed
soldering technique should be used.
on one printed-circuit board. However, wave soldering is
" The footprint must be at an angle of 45° to the board
not always suitable for surface mounted ICs, or for
direction and must incorporate solder thieves
printed-circuits with high population densities. In these
downstream and at the side corners.
situations reflow soldering is often used.
During placement and before soldering, the package must
This text gives a very brief insight to a complex technology.
be fixed with a droplet of adhesive. The adhesive can be
A more in-depth account of soldering ICs can be found in
applied by screen printing, pin transfer or syringe
our  Data Handbook IC26; Integrated Circuit Packages
dispensing. The package can be soldered after the
(order code 9398 652 90011).
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
15.2 Reflow soldering
maximum duration of package immersion in solder is
Reflow soldering techniques are suitable for all QFP
10 seconds, if cooled to less than 150 °C within
packages.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
The choice of heating method may be influenced by larger
A mildly-activated flux will eliminate the need for removal
plastic QFP packages (44 leads, or more). If infrared or
of corrosive residues in most applications.
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
15.4 Repairing soldered joints
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For details, Fix the component by first soldering two diagonally-
refer to the Drypack information in the  Data Handbook opposite end leads. Use only a low voltage soldering iron
IC26; Integrated Circuit Packages; Section: Packing (less than 24 V) applied to the flat part of the lead. Contact
Methods . time must be limited to 10 seconds at up to 300 °C. When [ Pobierz caÅ‚ość w formacie PDF ]